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FEATURES
  • High thermal conductivity and low thermal
  • resistance
  • Low stress assembly
  • Good thermal stability
  • Multiple thickness options, wide range of
  • applications
  • Slight color difference on the surface is a product
  • characteristic and does not affect
    • APPLICATIONS
  • Satellite, radar and other military fields
  • Between chip and heat-dissipation modules
  • Optoelectronic Industry
  • Netcom products
  • Wearable equipments
    • HFC Thermal Pad HFS-15 TDS
    產(chǎn)品參數(shù)
    Tensile StrengthItemsParameter Unit Test Standard
    ColorAsh blackVisual --
    Thickness 0.5-3.0 mm ASTM D 374
    Standard Size 120*120mm ASTM D 5947
    Desity 3.0(±0.2)g/cc ASTM D 792
    Hardness 65(±10)Shore 00ASTM D 2240
    Tensile Strength≥0.1
    		MpaASTM D 412
    Elongation≥50%ASTM D 412
    Compression Ratio≥40(@50psi)%ASTM D 575
    Thermal Conductivity24（±5）W/m·KASTM D 5470
    Thermal Resistance≤0.15(@30%/2mm)℃in2/WASTM D 5470
    Storge Conditions -40-130℃IEC 60068-2-14


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