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FEATURES
  • Low thermal resistance
  • Being recognized as UL94 V-0
  • Viscous surface
  • Being able to work under low pressure
  • Excellent insulation performance and thermal resistance
    • APPLICATIONS
  • Between chip and heat-dissipation modules
  • Optoelectronic Industry
  • Netcom products
  • New energy battery and vehicles industry
  • Household appliances
  • Wearable equipments
    • HFC Thermal Silicone Pad H1200 TDS
    產(chǎn)品參數(shù)
    Tensile StrengthItems Parameter Unit Test Standard
    Color Gray-
    		 Visual
    Thickness 0.5~3mm ASTM D 374
    Hardness 50（±10）Shore C ASTM D 2240
    Density 3.5（±0.5）g/cc ASTM D 792
    Tensile Strength ≥0.04Mpa ASTM D 412
    Elongation ≥40% ASTM D 412
    Compression Ratio ≥15(@30psi)% ASTM D 575
    UL Certification V-0 - UL-94
    Operating Temperature -40~125℃ IEC 60068
    Thermal conductivity 12.0（±1.0）W/m·k ASTM D 5470
    Thermal resistance ≤0.27(@10psi/2mm)°Cin2/W ASTM D 5470
    Breakdown voltage ≥5KV/mm ASTM D 149
    Volume resistivity ≥1010Ω·cm ASTM D 257
    Dielectric constant ≥2@1MHz ASTM D 150
    Dielectric loss ≤0.1@1MHz ASTM D 150


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