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FEATURES
  • Extremely low thermal resistance, efficient heat
  • dissipation.
  • Excellent heat transfer properties, and easy to
  • use.
  • Heat and pressure, the material will be further
  • thinned, thermal resistance will be lower.
  • excellent thermal stability, long-term use.
  • APPLICATIONS
  • Computer industry
  • IC market
  • Mobile phone industry
  • Network communication equipment
  • LED lighting
  • Automotive Electronics
  • Aerospace
  • HFC Phase Change HCM850 TDS
    產(chǎn)品參數(shù)
    Items Parameter Unit Test Method
    Color Dark Grey深灰色-
    Visual
    Thickness0.2-0.5
    mm ASTM D 374
    Density 2.8(±0.3)g/cc ASTM D 792
    Phase Change Temperature 50(±5) DSC
    Thermal conductivity 8.5(±0.5)W/m·K ASTM D 5470
    Thermal resistance ≤0.045(@40psi/80℃)℃in2/W ASTM D 5470
    Operating Temperature  -40~125 IEC 60068-2-14


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