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FEATURES

≥14.0W/m.K thermal conductivity

Replace traditional assembled sheets with

indefinite shapes

Dispensing can be done through various

manual or automatic processes

It is Soft, can eliminates assembly stress and

damping

APPLICATIONS

Semiconductors and radiator

LED lamps luminaries, automotive and

consumer electronics

Being dispensed or directly coated by all

kinds of thickness and shape

CPU and GPU

HFC Thermal Conductive Gel HTG-1400 TDS

產(chǎn)品參數(shù)

導熱系數(shù)（W/m·k）

Items	Parameter	Unit	Test Method
Color	Gray	-	Visua
Density	3.3（±0.3）	g/cc	ASTM D 792
Extrusion speed	≥15（@90psi）	g/min	φ2.41mm EFD _{Injection head}
Minimum filling gap	≤0.3	mm	--
volatilize Matter@200℃24H	≤200	PPM	GB269
Instantaneous Compression	＜10	Psi	GB/T 7757
Static Compression Stress	＜1	Psi	GB/T 7757
UL Certification	V-0	-	UL-94
Operating Temperatur	-40~125	℃	IEC 60068
Thermal conductivity	≥14.0	W/m·k	ASTM D 5470
Thermal resistance	≤0.06(@60psi)	℃in2/W	ASTM D 5470
Breakdown voltage	≥2	KV/mm	ASTM D 149
Volume resistivity	≥10¹⁰	Ω·cm	ASTM D 257
Storage conditions and package regulations	Refrigerate or store in a dark place，Storage temprature:<25°C，Storage humidity: ≤70% Packing specification:30cc/55cc/300cc